EP2C8AF256A7N vs A3P1000-FGG256M

This detailed comparison of EP2C8AF256A7N and A3P1000-FGG256M in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

EP2C8AF256A7N

Intel

A3P1000-FGG256M

Roving Networks / Microchip Technology

Specifications Hide identical items

Manufacturer	Intel	Roving Networks / Microchip Technology
Package / Case	256-LBGA	256-LBGA
Description	IC FPGA 182 I/O 256FBGA	IC FPGA 177 I/O 256FBGA
In Stock	809	56 460
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Cyclone® II	ProASIC3
Package	Tray	Tray
Number of LABs/CLBs	516	-
Number of Logic Elements/Cells	8256	-
Total RAM Bits	165888	147456
Number of I/O	182	177
Number of Gates	-	1000000
Voltage - Supply	1.15V ~ 1.25V	1.14V ~ 1.575V
Operating Temperature	-40°C ~ 125°C (TJ)	-55°C ~ 125°C (TJ)
Supplier Device Package	256-FBGA (17x17)	256-FBGA (17x17)

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