HCF4053BEY vs NX3L1G3157GM,115

This detailed comparison of HCF4053BEY and NX3L1G3157GM,115 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

HCF4053BEY

HCF4053BEY

STMicroelectronics

NX3L1G3157GM,115

NX3L1G3157GM,115

NXP Semiconductors

Specifications
Manufacturer STMicroelectronics NXP Semiconductors
Package / Case 16-DIP (0.300", 7.62mm) 6-XFDFN
Description IC MUX/DEMUX TRIPLE 2X1 16DIP IC SWITCH SPDT 6XSON
In Stock 459 0
Mounting Type Through Hole Surface Mount
Part Status Obsolete Obsolete
Series - -
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Switch Circuit SPDT SPDT
Multiplexer/Demultiplexer Circuit 2:1 2:1
Number of Circuits 3 1
On-State Resistance (Max) 280Ohm 750mOhm
Channel-to-Channel Matching (ΔRon) 5Ohm 20mOhm
Voltage - Supply, Single (V+) 3V ~ 20V 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) - -
Switch Time (Ton, Toff) (Max) - 25ns, 10ns
-3db Bandwidth 60MHz 60MHz
Charge Injection - 15pC
Channel Capacitance (CS(off), CD(off)) 0.2pF, 5pF 35pF
Current - Leakage (IS(off)) (Max) 100nA 10nA
Crosstalk -40dB @ 6MHz -
Operating Temperature -55°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 16-PDIP 6-XSON, SOT886 (1.45x1)
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