KMPC860PCVR50D4 vs MC860DECVR50D4R2

This detailed comparison of KMPC860PCVR50D4 and MC860DECVR50D4R2 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

KMPC860PCVR50D4

KMPC860PCVR50D4

NXP Semiconductors

MC860DECVR50D4R2

MC860DECVR50D4R2

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 357-BBGA 357-BBGA
Description IC MPU MPC8XX 50MHZ 357BGA IC MPU MPC8XX 50MHZ 357BGA
In Stock 2 338 6 632
Mounting Type - -
Part Status Obsolete Obsolete
Series MPC8xx MPC8xx
Package Tray Tape & Reel (TR)Cut Tape (CT)
Core Processor MPC8xx MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 50MHz
Co-Processors/DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Display & Interface Controllers - -
Ethernet 10Mbps (4), 10/100Mbps (1) 10Mbps (2)
SATA - -
USB - -
Voltage - I/O 3.3V 3.3V
Operating Temperature -40°C ~ 95°C (TA) -40°C ~ 95°C (TA)
Security Features - -
Supplier Device Package 357-PBGA (25x25) 357-PBGA (25x25)
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