L138-FI-236-RC vs L138-FI-336-RL

This detailed comparison of L138-FI-236-RC and L138-FI-336-RL in the Embedded - Microcontroller, Microprocessor, FPGA Modules provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

L138-FI-236-RC

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L138-FI-336-RL

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Specifications Hide identical items

Manufacturer	Critical Link	Critical Link
Package / Case	-	-
Description	MOD MITYDSP-L138F OMAP-L138	MITYDSP-L138F SOM W/ OMAP-L138
In Stock	2 500	5 178
Mounting Type	-	-
Part Status	Obsolete	Active
Series	MityDSP-L138F	MityDSP-L138F
Package	Bulk	Bag
Module/Board Type	MPU, DSP, FPGA Core	MPU, DSP, FPGA Core
Core Processor	ARM926EJ-S, OMAP-L138	ARM926EJ-S, OMAP-L138
Co-Processor	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed	456MHz	456MHz
Flash Size	512MB (NAND), 8MB (NOR)	512MB (NAND), 16MB (NOR)
RAM Size	8kB (Internal), 256MB (External)	256MB
Connector Type	SO-DIMM-200	SO-DIMM-200
Size / Dimension	2.66" x 2" (67.6mm x 50.8mm)	2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature	-40°C ~ 70°C	-40°C ~ 70°C