LPC1311FHN33/01,55 vs LPC1311FHN33,551

This detailed comparison of LPC1311FHN33/01,55 and LPC1311FHN33,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1311FHN33/01,55

NXP Semiconductors

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LPC1311FHN33,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 8KB FLASH 32HVQFN	IC MCU 32BIT 8KB FLASH 32HVQFN
In Stock	357	855
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC13xx	LPC13xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	72MHz	72MHz
Connectivity	I²C, Microwire, SPI, SSI, UART/USART	I²C, Microwire, SPI, SSI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	28
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	4K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (7x7)	32-HVQFN (7x7)