LPC1315FHN33,551 vs LPC1316FHN33,551

This detailed comparison of LPC1315FHN33,551 and LPC1316FHN33,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC1315FHN33,551

VIGOR

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LPC1316FHN33,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	32-VQFN Exposed Pad	32-VQFN Exposed Pad
Description	IC MCU 32BIT 32KB FLASH 32HVQFN	IC MCU 32BIT 48KB FLASH 32HVQFN
In Stock	260	59
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	LPC13xx	LPC13xx
Package	Bulk	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	72MHz	72MHz
Connectivity	I²C, Microwire, SPI, SSI, SSP, UART/USART	I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	Brown-out Detect/Reset, POR, WDT	Brown-out Detect/Reset, POR, WDT
Number of I/O	28	26
Program Memory Size	32KB (32K x 8)	48KB (48K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	2K x 8	4K x 8
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 8x12b	A/D 8x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	32-HVQFN (7x7)	32-HVQFN (7x7)