LPC2919FBD144/01/, vs LPC2917FBD144,551

This detailed comparison of LPC2919FBD144/01/, and LPC2917FBD144,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2919FBD144/01/,

LPC2919FBD144/01/,

NXP Semiconductors

LPC2917FBD144,551

LPC2917FBD144,551

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 144-LQFP 144-LQFP
Description IC MCU 16/32B 768KB FLSH 144LQFP IC MCU 16/32B 512KB FLSH 144LQFP
In Stock 0 0
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series LPC2900 LPC2900
Package Tray Tray
Core Processor ARM9® ARM9®
Core Size 16/32-Bit 16/32-Bit
Speed 80MHz 80MHz
Connectivity CANbus, EBI/EMI, LINbus, SPI, UART/USART CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 108 108
Program Memory Size 768KB (768K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 80K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V 1.71V ~ 3.6V
Data Converters A/D 16x10b A/D 16x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 144-LQFP (20x20) 144-LQFP (20x20)
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