LPC2921FBD100,551 vs LPC2925FBD100,551

This detailed comparison of LPC2921FBD100,551 and LPC2925FBD100,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC2921FBD100,551

NXP Semiconductors

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LPC2925FBD100,551

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 16/32B 128KB FLSH 100LQFP	IC MCU 16/32B 512KB FLSH 100LQFP
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Not For New Designs
Series	LPC2900	LPC2900
Package	Tray	Tray
Core Processor	ARM9®	ARM9®
Core Size	16/32-Bit	16/32-Bit
Speed	125MHz	125MHz
Connectivity	CANbus, I²C, LINbus, SPI, UART/USART, USB	CANbus, I²C, LINbus, SPI, UART/USART, USB
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	60	60
Program Memory Size	128KB (128K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	16K x 8	16K x 8
RAM Size	24K x 8	40K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 16x8b	A/D 16x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-LQFP (14x14)	100-LQFP (14x14)