LPC3154FET208,551 vs LPC3152FET208,551

This detailed comparison of LPC3154FET208,551 and LPC3152FET208,551 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC3154FET208,551

LPC3154FET208,551

NXP Semiconductors

LPC3152FET208,551

LPC3152FET208,551

VIGOR

Specifications
Manufacturer NXP Semiconductors VIGOR
Package / Case 208-TFBGA 208-TFBGA
Description IC MCU 16/32BIT ROMLESS 208TFBGA IC MCU 16/32BIT ROMLESS 208TFBGA
In Stock 0 10 493
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series LPC3100 LPC3100
Package Tray Tray
Core Processor ARM9® ARM9®
Core Size 16/32-Bit 16/32-Bit
Speed 180MHz 180MHz
Connectivity EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LCD, PWM, WDT DMA, I²S, LCD, PWM, WDT
Number of I/O 10 10
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 192K x 8 192K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V 1.1V ~ 3.6V
Data Converters A/D 3x10b A/D 3x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 208-TFBGA (12x12) 208-TFBGA (12x12)
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