LPC811M001JDH16 vs LPC811M001JDH16J

This detailed comparison of LPC811M001JDH16 and LPC811M001JDH16J in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC811M001JDH16

LPC811M001JDH16

Flip Electronics

LPC811M001JDH16J

LPC811M001JDH16J

NXP Semiconductors

Specifications
Manufacturer Flip Electronics NXP Semiconductors
Package / Case 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width)
Description IC MCU 32BIT 8KB FLASH 16TSSOP IC MCU 32BIT 8KB FLASH 16TSSOP
In Stock 440 2 510
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC81xM LPC81xM
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 30MHz 30MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 14 14
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters - -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 16-TSSOP 16-TSSOP
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