M1AGLE3000V5-FG896 vs EP2C70F896C7

This detailed comparison of M1AGLE3000V5-FG896 and EP2C70F896C7 in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

M1AGLE3000V5-FG896

M1AGLE3000V5-FG896

Microsemi

EP2C70F896C7

EP2C70F896C7

Intel

Specifications
Manufacturer Microsemi Intel
Package / Case 896-BGA 896-BGA
Description IC FPGA 620 I/O 896FBGA IC FPGA 622 I/O 896FBGA
In Stock 2 990 580
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series IGLOOe Cyclone® II
Package Tray Tray
Number of LABs/CLBs - 4276
Number of Logic Elements/Cells 75264 68416
Total RAM Bits 516096 1152000
Number of I/O 620 622
Number of Gates 3000000 -
Voltage - Supply 1.425V ~ 1.575V 1.15V ~ 1.25V
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 85°C (TJ)
Supplier Device Package 896-FBGA (31x31) 896-FBGA (31x31)
Part Number Manufacturer Description Request For Quote
5AGXMB5G6F40C6N Intel IC FPGA 704 I/O 1517FBGA
EP4SGX530HH35C2NAD Intel IC FPGA STRATIX IV GX FLIP CHIP
XCV800-4BG432I Xilinx IC FPGA 316 I/O 432MBGA
ORSO82G5-1FN680C Lattice Semiconductor IC FPGA 372 I/O 680FBGA
AX500-1PQ208I Roving Networks / Microchip Technology IC FPGA 115 I/O 208QFP
XCV200-4BG352C Xilinx IC FPGA 260 I/O 352MBGA
5SGSMD5K3F40C2WN Intel IC FPGA STRATIX V GS FLIP CHIP
XCV600-5BG432I Xilinx IC FPGA 316 I/O 432MBGA
5AGXFB1H6F40C6N Intel IC FPGA 704 I/O 1517FBGA
XCV300-4BG432I Xilinx IC FPGA 316 I/O 432MBGA
XC4010XL-09TQ176C Xilinx IC FPGA 145 I/O 176TQFP
XCV200-6BG352C Xilinx IC FPGA 260 I/O 352MBGA
EP4SEF35I4NAB Intel IC FPGA STRATIX IV E FLIP CHIP
A1240A-1PG132B Microsemi IC FPGA 104 I/O 132CPGA
XC4013E-1PQ160C Xilinx IC FPGA 129 I/O 160QFP
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