M2S050T-FGG896I vs M2S050TS-FGG896I

This detailed comparison of M2S050T-FGG896I and M2S050TS-FGG896I in the Embedded - System On Chip (SoC) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

M2S050T-FGG896I

Roving Networks / Microchip Technology

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M2S050TS-FGG896I

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	896-BGA	896-BGA
Description	IC SOC CORTEX-M3 166MHZ 896FBGA	IC SOC CORTEX-M3 166MHZ 896FBGA
In Stock	2 026	2 995
Mounting Type	-	-
Part Status	Active	Active
Series	SmartFusion®2	SmartFusion®2
Package	Tray	Tray
Architecture	MCU, FPGA	MCU, FPGA
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Flash Size	256KB	256KB
RAM Size	64KB	64KB
Peripherals	DDR, PCIe, SERDES	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz	166MHz
Primary Attributes	FPGA - 50K Logic Modules	FPGA - 50K Logic Modules
Operating Temperature	-40°C ~ 100°C (TJ)	-40°C ~ 100°C (TJ)
Supplier Device Package	896-FBGA (31x31)	896-FBGA (31x31)