MAXQ61HX-2047+ vs MAXQ61HX-2564+

This detailed comparison of MAXQ61HX-2047+ and MAXQ61HX-2564+ in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MAXQ61HX-2047+

MAXQ61HX-2047+

Maxim Integrated

MAXQ61HX-2564+

MAXQ61HX-2564+

Maxim Integrated

Specifications
Manufacturer Maxim Integrated Maxim Integrated
Package / Case Die Die
Description IC MCU 16BIT 36KB ROM DIE IC MCU 16BIT 36KB ROM DIE
In Stock 3 148 4 967
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series MAXQ® MAXQ®
Package Tray Tray
Core Processor MAXQ MAXQ
Core Size 16-Bit 16-Bit
Speed 12MHz 12MHz
Connectivity - -
Peripherals Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
Number of I/O 24 24
Program Memory Size 36KB (36K x 8) 36KB (36K x 8)
Program Memory Type ROM ROM
EEPROM Size - -
RAM Size 1.28K x 8 1.28K x 8
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V 1.7V ~ 3.6V
Data Converters - -
Oscillator Type - -
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C
Supplier Device Package Die Die
Top