MB89165PFV-G-299-BND-RE1 vs MB89165PFV-G-386-BND-RE1

This detailed comparison of MB89165PFV-G-299-BND-RE1 and MB89165PFV-G-386-BND-RE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89165PFV-G-299-BND-RE1

MB89165PFV-G-299-BND-RE1

Cypress Semiconductor

MB89165PFV-G-386-BND-RE1

MB89165PFV-G-386-BND-RE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 80-LQFP 80-LQFP
Description IC MCU 8BIT 16KB MROM 80LQFP IC MCU 8BIT 16KB MROM 80LQFP
In Stock 1 195 3 513
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89160 F²MC-8L MB89160
Package Tray Tray
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 4.2MHz 4.2MHz
Connectivity Serial I/O Serial I/O
Peripherals LCD, POR, PWM, WDT LCD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x8b A/D 8x8b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 80-LQFP (12x12) 80-LQFP (12x12)
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