MB89193APF-G-452-BND-RE1 vs MB89193APF-G-237-BND-RE1

This detailed comparison of MB89193APF-G-452-BND-RE1 and MB89193APF-G-237-BND-RE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89193APF-G-452-BND-RE1

Cypress Semiconductor

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MB89193APF-G-237-BND-RE1

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	28-SOIC (0.342", 8.69mm Width)	28-SOIC (0.342", 8.69mm Width)
Description	IC MCU 8BIT 8KB MROM 28SOP	IC MCU 8BIT 8KB MROM 28SOP
In Stock	1 495	1 207
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	F²MC-8L MB89190A	F²MC-8L MB89190A
Package	Tray	Tube
Core Processor	F²MC-8L	F²MC-8L
Core Size	8-Bit	8-Bit
Speed	4.2MHz	4.2MHz
Connectivity	Serial I/O	Serial I/O
Peripherals	POR, WDT	POR, WDT
Number of I/O	16	16
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	Mask ROM	Mask ROM
EEPROM Size	-	-
RAM Size	256 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 6V	2.2V ~ 6V
Data Converters	A/D 8x8b	A/D 8x8b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SOP	28-SOP