MB89537APF-G-1108E1 vs MB89537APF-G-360-BNDE1

This detailed comparison of MB89537APF-G-1108E1 and MB89537APF-G-360-BNDE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89537APF-G-1108E1

Cypress Semiconductor

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MB89537APF-G-360-BNDE1

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	64-BQFP	64-BQFP
Description	IC MCU 8BIT 32KB MROM 64QFP	IC MCU 8BIT 32KB MROM 64QFP
In Stock	2 766	1 599
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	F²MC-8L MB89530A	F²MC-8L MB89530A
Package	Tray	Tray
Core Processor	F²MC-8L	F²MC-8L
Core Size	8-Bit	8-Bit
Speed	12.5MHz	12.5MHz
Connectivity	I²C, Serial I/O, UART/USART	I²C, Serial I/O, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	38	38
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	Mask ROM	Mask ROM
EEPROM Size	-	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 5.5V	2.2V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-QFP (14x20)	64-QFP (14x20)