MB89537APF-G-360-BNDE1 vs MB89537APF-G-1108E1

This detailed comparison of MB89537APF-G-360-BNDE1 and MB89537APF-G-1108E1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89537APF-G-360-BNDE1

MB89537APF-G-360-BNDE1

Cypress Semiconductor

MB89537APF-G-1108E1

MB89537APF-G-1108E1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 64-BQFP 64-BQFP
Description IC MCU 8BIT 32KB MROM 64QFP IC MCU 8BIT 32KB MROM 64QFP
In Stock 1 599 2 766
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89530A F²MC-8L MB89530A
Package Tray Tray
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 12.5MHz 12.5MHz
Connectivity I²C, Serial I/O, UART/USART I²C, Serial I/O, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 38 38
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 5.5V 2.2V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-QFP (14x20) 64-QFP (14x20)
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