MB89653ARPF-G-367-BNDE1 vs MB89653ARPF-G-373-BNDE1

This detailed comparison of MB89653ARPF-G-367-BNDE1 and MB89653ARPF-G-373-BNDE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89653ARPF-G-367-BNDE1

Cypress Semiconductor

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MB89653ARPF-G-373-BNDE1

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	100-BQFP	100-BQFP
Description	IC MCU 8BIT 8KB MROM 100QFP	IC MCU 8BIT 8KB MROM 100QFP
In Stock	3 757	4 983
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	F²MC-8L MB89650AR	F²MC-8L MB89650AR
Package	Tray	Tray
Core Processor	F²MC-8L	F²MC-8L
Core Size	8-Bit	8-Bit
Speed	10MHz	10MHz
Connectivity	Serial I/O	Serial I/O
Peripherals	LCD, POR, PWM, WDT	LCD, POR, PWM, WDT
Number of I/O	48	48
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	Mask ROM	Mask ROM
EEPROM Size	-	-
RAM Size	256 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 6V	2.2V ~ 6V
Data Converters	A/D 8x8b	A/D 8x8b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-QFP (14x20)	100-QFP (14x20)