MB89663PF-GT-117-BNDE1 vs MB89663RPF-G-190-BNDE1

This detailed comparison of MB89663PF-GT-117-BNDE1 and MB89663RPF-G-190-BNDE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89663PF-GT-117-BNDE1

MB89663PF-GT-117-BNDE1

Cypress Semiconductor

MB89663RPF-G-190-BNDE1

MB89663RPF-G-190-BNDE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 64-BQFP 64-BQFP
Description IC MCU 8BIT 8KB MROM 64QFP IC MCU 8BIT 8KB MROM 64QFP
In Stock 2 743 2 500
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89660 F²MC-8L MB89660R
Package Tray Tray
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity Serial I/O, UART/USART Serial I/O, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 36 36
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x8b A/D 8x8b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-QFP (14x20) 64-QFP (14x20)
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