MB89935BPFV-G-210-BND-ER vs MB89935BPFV-GS-277-ERE1

This detailed comparison of MB89935BPFV-G-210-BND-ER and MB89935BPFV-GS-277-ERE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89935BPFV-G-210-BND-ER

Cypress Semiconductor

Request For Quote

MB89935BPFV-GS-277-ERE1

Cypress Semiconductor

Request For Quote

Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	30-LSSOP (0.220", 5.60mm Width)	30-LSSOP (0.220", 5.60mm Width)
Description	IC MCU 8BIT 16KB MROM 30SSOP	IC MCU 8BIT 16KB MROM 30SSOP
In Stock	6 140	8 390
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	F²MC-8L MB89930A	F²MC-8L MB89930A
Package	Tube	Tube
Core Processor	F²MC-8L	F²MC-8L
Core Size	8-Bit	8-Bit
Speed	10MHz	10MHz
Connectivity	Serial I/O, UART/USART	Serial I/O, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	16KB (16K x 8)	16KB (16K x 8)
Program Memory Type	Mask ROM	Mask ROM
EEPROM Size	-	-
RAM Size	512 x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 5.5V	2.2V ~ 5.5V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	30-SSOP	30-SSOP