MB89P625PMC-G-LE1 vs MB89625RPMC-G-604-BNDE1

This detailed comparison of MB89P625PMC-G-LE1 and MB89625RPMC-G-604-BNDE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89P625PMC-G-LE1

MB89P625PMC-G-LE1

Cypress Semiconductor

MB89625RPMC-G-604-BNDE1

MB89625RPMC-G-604-BNDE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 64-LQFP 64-LQFP
Description IC MCU 8BIT 16KB OTP 64QFP IC MCU 8BIT 16KB MROM 64QFP
In Stock 2 485 2 350
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89620R F²MC-8L MB89620R
Package - Tray
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity EBI/EMI, Serial I/O EBI/EMI, Serial I/O
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type OTP Mask ROM
EEPROM Size - -
RAM Size 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x8b A/D 8x8b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-QFP (12x12) 64-QFP (12x12)
Part Number Manufacturer Description Request For Quote
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