MC33909Q3ADR2 vs MC33909D3AD

This detailed comparison of MC33909Q3ADR2 and MC33909D3AD in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC33909Q3ADR2

MC33909Q3ADR2

NXP Semiconductors

MC33909D3AD

MC33909D3AD

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 48-LQFP Exposed Pad 48-LQFP Exposed Pad
Description SBC 3V 1CAN 0LIN 6SG HLQFP48 SBC 3V 1CAN 0LIN 6SG HLQFP48
In Stock 2 000 2 000
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series - -
Package Tape & Reel (TR) Tray
Applications System Basis Chip System Basis Chip
Current - Supply 7mA 7mA
Voltage - Supply 3.5V ~ 28V 3.5V ~ 28V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C
Supplier Device Package 48-LQFP-EP (7x7) 48-LQFP-EP (7x7)
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