MC33FS5502Y3ESR2 vs MCP16501TB-E/RMB

This detailed comparison of MC33FS5502Y3ESR2 and MCP16501TB-E/RMB in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC33FS5502Y3ESR2

NXP Semiconductors

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MCP16501TB-E/RMB

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Roving Networks / Microchip Technology
Package / Case	56-VFQFN Exposed Pad	24-VFQFN Exposed Pad
Description	HIGH VOLTAGE PMIC QFN56	PMIC FOR SAMA5DX/SAM9X6 MPUS
In Stock	1 913	150
Mounting Type	Surface Mount, Wettable Flank	Surface Mount
Part Status	Active	Active
Series	Automotive, AEC-Q100	-
Package	Tape & Reel (TR)	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Applications	Automotive, Power Supplies	Processor
Current - Supply	15mA	14mA
Voltage - Supply	60V	2.7V ~ 5.5V
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TJ)
Supplier Device Package	56-HVQFN (8x8)	24-VQFN (4x4)