MC56F8357MPYE vs MC56F8367MPYE

This detailed comparison of MC56F8357MPYE and MC56F8367MPYE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC56F8357MPYE

MC56F8357MPYE

NXP Semiconductors

MC56F8367MPYE

MC56F8367MPYE

VIGOR

Specifications
Manufacturer NXP Semiconductors VIGOR
Package / Case 160-LQFP 160-LQFP
Description IC MCU 16BIT 256KB FLASH 160LQFP IC MCU 16BIT 512KB FLASH 160LQFP
In Stock 0 1 000
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series 56F8xxx 56F8xxx
Package Tray Bulk
Core Processor 56800E 56800E
Core Size 16-Bit 16-Bit
Speed 60MHz 60MHz
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 76 76
Program Memory Size 256KB (128K x 16) 512KB (256K x 16)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 10K x 16 18K x 16
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 2.25V ~ 3.6V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 160-LQFP (24x24) 160-LQFP (24x24)
Part Number Manufacturer Description Request For Quote
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