MC56F8357MPYE vs MC56F8367MPYE

This detailed comparison of MC56F8357MPYE and MC56F8367MPYE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC56F8357MPYE

NXP Semiconductors

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MC56F8367MPYE

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	160-LQFP	160-LQFP
Description	IC MCU 16BIT 256KB FLASH 160LQFP	IC MCU 16BIT 512KB FLASH 160LQFP
In Stock	0	1 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	56F8xxx	56F8xxx
Package	Tray	Bulk
Core Processor	56800E	56800E
Core Size	16-Bit	16-Bit
Speed	60MHz	60MHz
Connectivity	CANbus, EBI/EMI, SCI, SPI	CANbus, EBI/EMI, SCI, SPI
Peripherals	POR, PWM, Temp Sensor, WDT	POR, PWM, Temp Sensor, WDT
Number of I/O	76	76
Program Memory Size	256KB (128K x 16)	512KB (256K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	10K x 16	18K x 16
Voltage - Supply (Vcc/Vdd)	2.25V ~ 3.6V	2.25V ~ 3.6V
Data Converters	A/D 16x12b	A/D 16x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	160-LQFP (24x24)	160-LQFP (24x24)