MC705P6ACPE vs MC705P6ECPE

This detailed comparison of MC705P6ACPE and MC705P6ECPE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC705P6ACPE

NXP Semiconductors

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MC705P6ECPE

Flip Electronics

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	Flip Electronics
Package / Case	28-DIP (0.600", 15.24mm)	28-DIP (0.600", 15.24mm)
Description	IC MCU 8BIT 4.5KB OTP 28DIP	8 BIT OTP MCU - 705P6E - EPP
In Stock	1 287	32 433
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Obsolete
Series	HC05	HC05
Package	Tube	Tube
Core Processor	HC05	HC05
Core Size	8-Bit	8-Bit
Speed	2.1MHz	2.1MHz
Connectivity	SIO	SIO
Peripherals	POR, WDT	POR, WDT
Number of I/O	21	21
Program Memory Size	4.5KB (4.5K x 8)	4.5KB (4.5K x 8)
Program Memory Type	OTP	OTP
EEPROM Size	-	-
RAM Size	176 x 8	176 x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 4x8b	A/D 4x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-PDIP	28-PDIP