MC88916EG80 vs DSC557-0344FI0

This detailed comparison of MC88916EG80 and DSC557-0344FI0 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC88916EG80

MC88916EG80

Renesas Electronics America

DSC557-0344FI0

DSC557-0344FI0

Roving Networks / Microchip Technology

Specifications
Manufacturer Renesas Electronics America Roving Networks / Microchip Technology
Package / Case 20-SOIC (0.295", 7.50mm Width) 14-VFQFN Exposed Pad
Description IC CLK BUF CISC 80MHZ 1CIRC MEMS OSC XO 100.0000MHZ HCSL SMD
In Stock 3 400 465
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - DSC557-03
Package Tube Tube
PLL Yes Yes
Main Purpose CISC/RISC Microprocessor PCI Express (PCIe)
Input CMOS, TTL -
Output CMOS HCSL
Number of Circuits 1 1
Ratio - Input:Output 1:6 0:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 80MHz 100MHz
Voltage - Supply 4.5V ~ 5.5V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 20-SOIC 14-QFN (2.5x3.2)
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