sales@vigorcomp.com
+65 90176838 Service time: Monday to Friday 9:00-18:00
Inter
BOM Account 0
Expand menu

MC9S08QA2CDNE vs S9S08QD2J1MSCR

This detailed comparison of MC9S08QA2CDNE and S9S08QD2J1MSCR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08QA2CDNE

MC9S08QA2CDNE

NXP Semiconductors

S9S08QD2J1MSCR

S9S08QD2J1MSCR

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Description IC MCU 8BIT 2KB FLASH 8SOIC IC MCU 8BIT 2KB FLASH 8SOIC
In Stock 2 188 1 091
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series S08 S08
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor S08 S08
Core Size 8-Bit 8-Bit
Speed 20MHz 16MHz
Connectivity - -
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 4 4
Program Memory Size 2KB (2K x 8) 2KB (2K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 160 x 8 128 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 2.7V ~ 5.5V
Data Converters A/D 4x10b A/D 4x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 8-SOIC 8-SOIC
Top