MC9S12DT256CCPV vs MC9S12DG256MPVE

This detailed comparison of MC9S12DT256CCPV and MC9S12DG256MPVE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12DT256CCPV

NXP Semiconductors

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MC9S12DG256MPVE

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 16BIT 256KB FLASH 112LQFP	IC MCU 16BIT 256KB FLASH 112LQFP
In Stock	7 839	313
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	HCS12	HCS12
Package	Tray	Tray
Core Processor	HCS12	HCS12
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	CANbus, I²C, SCI, SPI	CANbus, I²C, SCI, SPI
Peripherals	PWM, WDT	PWM, WDT
Number of I/O	91	91
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	4K x 8
RAM Size	12K x 8	12K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.25V	2.35V ~ 5.25V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)