MCF54452CVR200 vs MCF54453CVR200

This detailed comparison of MCF54452CVR200 and MCF54453CVR200 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCF54452CVR200

NXP Semiconductors

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MCF54453CVR200

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	360-BBGA	360-BBGA
Description	IC MCU 32BIT ROMLESS 360TEPBGA	IC MCU 32BIT ROMLESS 360TEPBGA
In Stock	600	650
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MCF5445x	MCF5445x
Package	Tray	Tray
Core Processor	Coldfire V4	Coldfire V4
Core Size	32-Bit	32-Bit
Speed	200MHz	200MHz
Connectivity	I²C, SPI, SSI, UART/USART, USB OTG	I²C, SPI, SSI, UART/USART, USB OTG
Peripherals	DMA, WDT	DMA, WDT
Number of I/O	132	132
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	1.35V ~ 3.6V	1.35V ~ 3.6V
Data Converters	-	-
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	360-TEPBGA (23x23)	360-TEPBGA (23x23)