MCIMX6L3DVN10AB vs MCIMX6V7DVN10AB

This detailed comparison of MCIMX6L3DVN10AB and MCIMX6V7DVN10AB in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX6L3DVN10AB

MCIMX6L3DVN10AB

NXP Semiconductors

MCIMX6V7DVN10AB

MCIMX6V7DVN10AB

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 432-TFBGA 432-TFBGA
Description IC MPU I.MX6SL 1.0GHZ 432MAPBGA I.MX 6 32BIT MPU 1GHZ 432MAPBGA
In Stock 5 100 136
Mounting Type - -
Part Status Active Active
Series i.MX6SL i.MX6SLL
Package Tray Tray
Core Processor ARM® Cortex®-A9 ARM® Cortex®-A9
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 1GHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, LVDDR3, DDR3 LPDDR2, LPDDR3
Graphics Acceleration Yes Yes
Display & Interface Controllers Keypad, LCD EPDC, LCD
Ethernet 10/100Mbps (1) -
SATA - -
USB USB 2.0 + PHY (3) USB 2.0 OTG + PHY (2)
Voltage - I/O 1.2V, 1.8V, 3.0V 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection A-HAB, ARM TZ, CSU, SJC, SNVS
Supplier Device Package 432-MAPBGA (13x13) 432-MAPBGA (13x13)
Top