MCIMX7D3EVK10SD vs MCIMX7D3EVK10SC

This detailed comparison of MCIMX7D3EVK10SD and MCIMX7D3EVK10SC in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX7D3EVK10SD

NXP Semiconductors

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MCIMX7D3EVK10SC

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	488-TFBGA	488-TFBGA
Description	I.MX 7DUAL: REV 1.3	NO EPDC, 2 ETH, NO CAN, 2 OTG 1
In Stock	586	1 640
Mounting Type	-	-
Part Status	Active	Obsolete
Series	i.MX7D	i.MX7D
Package	Tray	Tray
Core Processor	ARM® Cortex®-A7, ARM® Cortex®-M4	ARM® Cortex®-A7, ARM® Cortex®-M4
Number of Cores/Bus Width	2 Core, 32-Bit	2 Core, 32-Bit
Speed	1.0GHz	1.0GHz
Co-Processors/DSP	Multimedia; NEON™ MPE	Multimedia; NEON™ MPE
RAM Controllers	LPDDR2, LPDDR3, DDR3, DDR3L	LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration	No	No
Display & Interface Controllers	Keypad, LCD, MIPI	Keypad, LCD, MIPI
Ethernet	10/100/1000Mbps (2)	10/100/1000Mbps (2)
SATA	-	-
USB	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)	USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O	1.8V, 3.3V	1.8V, 3.3V
Operating Temperature	-20°C ~ 105°C (TJ)	-20°C ~ 105°C (TJ)
Security Features	A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS	A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Supplier Device Package	488-FBGA (12x12)	488-FBGA (12x12)