MCP2003AT-E/SN vs TJA1022HGZ

This detailed comparison of MCP2003AT-E/SN and TJA1022HGZ in the Interface - Drivers, Receivers, Transceivers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCP2003AT-E/SN

MCP2003AT-E/SN

Roving Networks / Microchip Technology

TJA1022HGZ

TJA1022HGZ

NXP Semiconductors

Specifications
Manufacturer Roving Networks / Microchip Technology NXP Semiconductors
Package / Case 8-SOIC (0.154", 3.90mm Width) 24-VFQFN Exposed Pad
Description IC TRANSCEIVER HALF 1/1 8SOIC IC TRANSCEIVER 2/2 24DHVQFN
In Stock 1 009 1 780
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - Automotive, AEC-Q100
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)
Type Transceiver Transceiver
Protocol LINbus LIN
Number of Drivers/Receivers 1/1 2/2
Duplex Half -
Receiver Hysteresis 175 mV 175 mV
Data Rate - 20kBaud
Voltage - Supply 6V ~ 27V 5V ~ 18V
Operating Temperature -40°C ~ 125°C -40°C ~ 150°C (TJ)
Supplier Device Package 8-SOIC 24-DHVQFN (3.5x5.5)
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