MCZ33689DEW vs RAA458100GNP#HC0

This detailed comparison of MCZ33689DEW and RAA458100GNP#HC0 in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCZ33689DEW

MCZ33689DEW

NXP Semiconductors

RAA458100GNP#HC0

RAA458100GNP#HC0

Renesas Electronics America

Specifications
Manufacturer NXP Semiconductors Renesas Electronics America
Package / Case 32-BSSOP (0.295", 7.50mm Width) 40-UFQFN Exposed Pad
Description IC SYSTEM BASIS CHIP LIN 32-SOIC MSIG- TXIC
In Stock 1 571 9 000
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series - -
Package Tube Tape & Reel (TR)
Applications Automotive Power Supplies, Wireless Charging
Current - Supply 5mA 5mA
Voltage - Supply 5.5V ~ 18V 4.4V ~ 5.25V
Operating Temperature -40°C ~ 125°C -20°C ~ 60°C (TA)
Supplier Device Package 32-SOIC 40-HUQFN (5x5)
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