MK60DX256VMD10 vs MK60DN256VMD10

This detailed comparison of MK60DX256VMD10 and MK60DN256VMD10 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK60DX256VMD10

NXP Semiconductors

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MK60DN256VMD10

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LBGA	144-LBGA
Description	IC MCU 32B 256KB FLASH 144MAPBGA	IC MCU 32B 256KB FLASH 144MAPBGA
In Stock	115	273
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K60	Kinetis K60
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	100MHz	100MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LVD, POR, PWM, WDT	DMA, I²S, LVD, POR, PWM, WDT
Number of I/O	100	100
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	-
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 42x16b; D/A 2x12b	A/D 42x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	144-MAPBGA (13x13)	144-MAPBGA (13x13)