MM908E622ACPEKR2 vs MM908E625ACDWB

This detailed comparison of MM908E622ACPEKR2 and MM908E625ACDWB in the Embedded - Microcontrollers - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MM908E622ACPEKR2

MM908E622ACPEKR2

NXP Semiconductors

MM908E625ACDWB

MM908E625ACDWB

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Description IC QUAD HALF BRDG TRPL SW 54SOIC IC QUAD HALF BRDG MCU/LIN 54SOIC
In Stock 3 955 2 500
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series - -
Package Tape & Reel (TR)Digi-Reel® Tube
Applications Automotive Mirror Control Automotive Mirror Control
Core Processor HC08 HC08
Program Memory Type FLASH (16kB) FLASH (16kB)
Controller Series 908E 908E
RAM Size 512 x 8 512 x 8
Interface SCI, SPI SCI, SPI
Number of I/O 12 13
Voltage - Supply 9V ~ 16V 8V ~ 18V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 54-SOIC-EP 54-SOIC-EP
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