MPC555LFMZP40 vs MPC555LFMZP40R2

This detailed comparison of MPC555LFMZP40 and MPC555LFMZP40R2 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MPC555LFMZP40

NXP Semiconductors

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MPC555LFMZP40R2

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	272-BBGA	272-BBGA
Description	IC MCU 32BIT 448KB FLASH 272PBGA	IC MCU 32BIT 448KB FLASH 272PBGA
In Stock	338	693
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	MPC5xx	MPC5xx
Package	Tray	Tape & Reel (TR)
Core Processor	PowerPC	PowerPC
Core Size	32-Bit	32-Bit
Speed	40MHz	40MHz
Connectivity	CANbus, EBI/EMI, SCI, SPI, UART/USART	CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	101	101
Program Memory Size	448KB (448K x 8)	448KB (448K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	26K x 8	26K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 32x10b	A/D 32x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	272-PBGA (27x27)	272-PBGA (27x27)