MPC875VR66-NXP vs XPC850VR50BU

This detailed comparison of MPC875VR66-NXP and XPC850VR50BU in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MPC875VR66-NXP

MPC875VR66-NXP

VIGOR

XPC850VR50BU

XPC850VR50BU

NXP Semiconductors

Specifications
Manufacturer VIGOR NXP Semiconductors
Package / Case 256-BBGA 256-BBGA
Description POWERQUICC 32 BIT POWER ARCHITEC IC MPU MPC8XX 50MHZ 256BGA
In Stock 135 2 000
Mounting Type - -
Part Status Active Obsolete
Series - MPC8xx
Package Bulk Tray
Core Processor MPC8xx MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 66MHz 50MHz
Co-Processors/DSP Communications; CPM, Security; SEC Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Display & Interface Controllers - -
Ethernet 10Mbps (1), 10/100Mbps (2) 10Mbps (1)
SATA - -
USB USB 2.0 (1) USB 1.x (1)
Voltage - I/O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 95°C (TA)
Security Features Cryptography -
Supplier Device Package 256-PBGA (23x23) 256-PBGA (23x23)
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