MSP430F417TDE1 vs MSP430F417TDE2

This detailed comparison of MSP430F417TDE1 and MSP430F417TDE2 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MSP430F417TDE1

Texas Instruments

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MSP430F417TDE2

Texas Instruments

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Specifications Hide identical items

Manufacturer	Texas Instruments	Texas Instruments
Package / Case	Die	Die
Description	IC MCU 16BIT 32KB FLASH DIE	IC MCU 16BIT 32KB FLASH DIE
In Stock	222	385
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MSP430x4xx	MSP430x4xx
Package	Bulk	Bulk
Core Processor	MSP430	MSP430
Core Size	16-Bit	16-Bit
Speed	8MHz	8MHz
Connectivity	-	-
Peripherals	Brown-out Detect/Reset, LCD, POR, PWM, WDT	Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O	48	48
Program Memory Size	32KB (32K x 8 + 256B)	32KB (32K x 8 + 256B)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	Slope A/D	Slope A/D
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	Die	Die