MT52L256M64D2LZ-107 WT:B vs MT52L256M64D2LZ-107 XT:B TR

This detailed comparison of MT52L256M64D2LZ-107 WT:B and MT52L256M64D2LZ-107 XT:B TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MT52L256M64D2LZ-107 WT:B

Micron Technology

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MT52L256M64D2LZ-107 XT:B TR

Micron Technology

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Specifications Hide identical items

Manufacturer	Micron Technology	Micron Technology
Package / Case	216-WFBGA	216-WFBGA
Description	IC DRAM 16GBIT 933MHZ 216FBGA	IC DRAM 16GBIT 933MHZ 216FBGA
In Stock	234	541
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	-	-
Package	Tray	Tape & Reel (TR)
Memory Type	Volatile	Volatile
Memory Format	DRAM	DRAM
Technology	SDRAM - Mobile LPDDR3	SDRAM - Mobile LPDDR3
Memory Size	16Gb (256M x 64)	16Gb (256M x 64)
Memory Interface	-	-
Clock Frequency	933 MHz	933 MHz
Write Cycle Time - Word, Page	-	-
Access Time	-	-
Voltage - Supply	1.2V	1.2V
Operating Temperature	-30°C ~ 85°C (TC)	-30°C ~ 105°C (TC)
Supplier Device Package	216-FBGA (12x12)	216-FBGA (12x12)