MT53B256M32D1DS-062 AAT:C TR vs MT53B384M32D2DS-062 XT:B

This detailed comparison of MT53B256M32D1DS-062 AAT:C TR and MT53B384M32D2DS-062 XT:B in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MT53B256M32D1DS-062 AAT:C TR

Micron Technology

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MT53B384M32D2DS-062 XT:B

Micron Technology

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Specifications Hide identical items

Manufacturer	Micron Technology	Micron Technology
Package / Case	200-WFBGA	200-WFBGA
Description	IC DRAM 8GBIT 1600MHZ 200WFBGA	IC DRAM 12GBIT 1600MHZ 200WFBGA
In Stock	210	522
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	Automotive, AEC-Q100	-
Package	Tape & Reel (TR)	Tray
Memory Type	Volatile	Volatile
Memory Format	DRAM	DRAM
Technology	SDRAM - Mobile LPDDR4	SDRAM - Mobile LPDDR4
Memory Size	8Gb (256M x 32)	12Gb (384M x 32)
Memory Interface	-	-
Clock Frequency	1.6 GHz	1.6 GHz
Write Cycle Time - Word, Page	-	-
Access Time	-	-
Voltage - Supply	1.1V	1.1V
Operating Temperature	-40°C ~ 105°C (TC)	-30°C ~ 105°C (TC)
Supplier Device Package	200-WFBGA (10x14.5)	200-WFBGA (10x14.5)