MT53B256M64D2TG-062 XT ES:C vs MT53B256M64D2PX-062 XT ES:C TR

This detailed comparison of MT53B256M64D2TG-062 XT ES:C and MT53B256M64D2PX-062 XT ES:C TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MT53B256M64D2TG-062 XT ES:C

MT53B256M64D2TG-062 XT ES:C

Micron Technology

MT53B256M64D2PX-062 XT ES:C TR

MT53B256M64D2PX-062 XT ES:C TR

Micron Technology

Specifications
Manufacturer Micron Technology Micron Technology
Package / Case - -
Description IC DRAM 16GBIT 1600MHZ FBGA IC DRAM 16GBIT 1600MHZ FBGA
In Stock 899 512
Mounting Type - -
Part Status Obsolete Active
Series - -
Package Tray Tape & Reel (TR)
Memory Type Volatile Volatile
Memory Format DRAM DRAM
Technology SDRAM - Mobile LPDDR4 SDRAM - Mobile LPDDR4
Memory Size 16Gb (256M x 64) 16Gb (256M x 64)
Memory Interface - -
Clock Frequency 1.6 GHz 1.6 GHz
Write Cycle Time - Word, Page - -
Access Time - -
Voltage - Supply 1.1V 1.1V
Operating Temperature -30°C ~ 105°C (TC) -30°C ~ 105°C (TC)
Supplier Device Package - -
Part Number Manufacturer Description Request For Quote
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