NX3DV3899GU,115 vs ADG1434YRUZ

This detailed comparison of NX3DV3899GU,115 and ADG1434YRUZ in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

NX3DV3899GU,115

NX3DV3899GU,115

NXP Semiconductors

ADG1434YRUZ

ADG1434YRUZ

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer NXP Semiconductors Linear Technology (Analog Devices, Inc.)
Package / Case 16-XFQFN 20-TSSOP (0.173", 4.40mm Width)
Description IC ANLG SWITCH DPDT 16XQFN IC SWITCH QUAD SPDT 20TSSOP
In Stock 17 677 37
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Switch Circuit DPDT SPDT
Multiplexer/Demultiplexer Circuit 2:2 2:1
Number of Circuits 2 4
On-State Resistance (Max) 3.3Ohm 4.7Ohm
Channel-to-Channel Matching (ΔRon) 700mOhm -
Voltage - Supply, Single (V+) 1.4V ~ 4.3V 5V ~ 16.5V
Voltage - Supply, Dual (V±) - ±4.5V ~ 16.5V
Switch Time (Ton, Toff) (Max) 40ns, 20ns 170ns, 75ns
-3db Bandwidth 200MHz 200MHz
Charge Injection 4pC -50pC
Channel Capacitance (CS(off), CD(off)) 8pF 12pF, 22pF
Current - Leakage (IS(off)) (Max) 5nA 300pA
Crosstalk -90dB @ 1MHz -70dB @ 1MHz
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 16-XQFN (1.8x2.6) 20-TSSOP
Channel-to-Channel Matching (ΔRon) - 500mOhm
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