NX3L1G3157GM,115 vs HCF4053BEY

This detailed comparison of NX3L1G3157GM,115 and HCF4053BEY in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

NX3L1G3157GM,115

NX3L1G3157GM,115

NXP Semiconductors

HCF4053BEY

HCF4053BEY

STMicroelectronics

Specifications
Manufacturer NXP Semiconductors STMicroelectronics
Package / Case 6-XFDFN 16-DIP (0.300", 7.62mm)
Description IC SWITCH SPDT 6XSON IC MUX/DEMUX TRIPLE 2X1 16DIP
In Stock 0 459
Mounting Type Surface Mount Through Hole
Part Status Obsolete Obsolete
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Switch Circuit SPDT SPDT
Multiplexer/Demultiplexer Circuit 2:1 2:1
Number of Circuits 1 3
On-State Resistance (Max) 750mOhm 280Ohm
Channel-to-Channel Matching (ΔRon) 20mOhm 5Ohm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V 3V ~ 20V
Voltage - Supply, Dual (V±) - -
Switch Time (Ton, Toff) (Max) 25ns, 10ns -
-3db Bandwidth 60MHz 60MHz
Charge Injection 15pC -
Channel Capacitance (CS(off), CD(off)) 35pF 0.2pF, 5pF
Current - Leakage (IS(off)) (Max) 10nA 100nA
Crosstalk - -40dB @ 6MHz
Operating Temperature -40°C ~ 125°C (TA) -55°C ~ 125°C (TA)
Supplier Device Package 6-XSON, SOT886 (1.45x1) 16-PDIP
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