NX3L1T53GM,125 vs NX3L1T3157GM,132

This detailed comparison of NX3L1T53GM,125 and NX3L1T3157GM,132 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

NX3L1T53GM,125

NX3L1T53GM,125

NXP Semiconductors

NX3L1T3157GM,132

NX3L1T3157GM,132

VIGOR

Specifications
Manufacturer NXP Semiconductors VIGOR
Package / Case 8-XFQFN Exposed Pad 6-XFDFN
Description IC ANALOG SWITCH SPDT 8XQFN IC SWITCH SPDT 6XSON
In Stock 361 23 690
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Bulk
Switch Circuit SPDT SPDT
Multiplexer/Demultiplexer Circuit 2:1 2:1
Number of Circuits 1 1
On-State Resistance (Max) 750mOhm 500mOhm
Channel-to-Channel Matching (ΔRon) 20mOhm 20mOhm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) - -
Switch Time (Ton, Toff) (Max) 40ns, 20ns 40ns, 20ns
-3db Bandwidth 60MHz 60MHz
Charge Injection 15pC 15pC
Channel Capacitance (CS(off), CD(off)) 35pF 35pF
Current - Leakage (IS(off)) (Max) 10nA 10nA
Crosstalk -90dB @ 100kHz -
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 8-XQFN (1.6x1.6) 6-XSON, SOT886 (1.45x1)
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