NX3L2467GU,115 vs ADG5208FBCPZ-RL7

This detailed comparison of NX3L2467GU,115 and ADG5208FBCPZ-RL7 in the Interface - Analog Switches, Multiplexers, Demultiplexers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

NX3L2467GU,115

NX3L2467GU,115

NXP Semiconductors

ADG5208FBCPZ-RL7

ADG5208FBCPZ-RL7

Linear Technology (Analog Devices, Inc.)

Specifications
Manufacturer NXP Semiconductors Linear Technology (Analog Devices, Inc.)
Package / Case 16-XFQFN 16-WQFN Exposed Pad, CSP
Description IC ANLG SWITCH DPDT 16XQFN IC SWITCH SINGLE 16LFCSP
In Stock 2 180 763
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Switch Circuit DPDT -
Multiplexer/Demultiplexer Circuit 2:2 8:1
Number of Circuits 2 1
On-State Resistance (Max) 750mOhm 160Ohm
Channel-to-Channel Matching (ΔRon) 70mOhm 3.5Ohm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V 9V ~ 40V
Voltage - Supply, Dual (V±) - ±9V ~ 22V
Switch Time (Ton, Toff) (Max) 40ns, 20ns 170ns, 140ns
-3db Bandwidth 60MHz 60MHz
Charge Injection 15pC 0.3pC
Channel Capacitance (CS(off), CD(off)) 35pF 2.8pF, 33pF
Current - Leakage (IS(off)) (Max) 10nA 100pA
Crosstalk -90dB @ 100kHz -90dB @ 1MHz
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C
Supplier Device Package 16-XQFN (1.8x2.6) 16-LFCSP (4x4)
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