PCX755CVZFU400LE vs PCX755BVZFU350LE

This detailed comparison of PCX755CVZFU400LE and PCX755BVZFU350LE in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PCX755CVZFU400LE

PCX755CVZFU400LE

Roving Networks / Microchip Technology

PCX755BVZFU350LE

PCX755BVZFU350LE

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 360-BBGA Exposed Pad 360-BBGA Exposed Pad
Description IC MPU POWERPC 400MHZ 360BGA IC MPU POWERPC 350MHZ 360BGA
In Stock 565 786
Mounting Type - -
Part Status Obsolete Obsolete
Series - -
Package Tray Tray
Core Processor PowerPC PowerPC
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 350MHz
Co-Processors/DSP - -
RAM Controllers - -
Graphics Acceleration No No
Display & Interface Controllers - -
Ethernet - -
SATA - -
USB - -
Voltage - I/O 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 110°C (TJ) -40°C ~ 110°C (TJ)
Security Features - -
Supplier Device Package 360-PBGA (25x25) 360-PBGA (25x25)
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