PIC16F18456-E/SP vs PIC16LF18456-I/SP

This detailed comparison of PIC16F18456-E/SP and PIC16LF18456-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16F18456-E/SP

PIC16F18456-E/SP

Roving Networks / Microchip Technology

PIC16LF18456-I/SP

PIC16LF18456-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 28KB FLASH 28SPDIP IC MCU 8BIT 28KB FLASH 28SPDIP
In Stock 625 138
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 16F PIC® XLP™ 16F
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 32MHz 32MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 26 26
Program Memory Size 28KB (16K x 14) 28KB (16K x 14)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2.5V ~ 5.5V 1.8V ~ 3.6V
Data Converters A/D 24x12b; D/A 1x5b A/D 24x12b; D/A 1x5b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
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