PIC18F23K22-I/SP vs PIC18LF25K22-I/SP

This detailed comparison of PIC18F23K22-I/SP and PIC18LF25K22-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F23K22-I/SP

Roving Networks / Microchip Technology

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PIC18LF25K22-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 8KB FLASH 28SPDIP	IC MCU 8BIT 32KB FLASH 28SPDIP
In Stock	144	0
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 18K	PIC® XLP™ 18K
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	64MHz	64MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, HLVD, POR, PWM, WDT	Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O	24	24
Program Memory Size	8KB (4K x 16)	32KB (16K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	256 x 8	256 x 8
RAM Size	512 x 8	1.5K x 8
Voltage - Supply (Vcc/Vdd)	2.3V ~ 5.5V	1.8V ~ 3.6V
Data Converters	A/D 19x10b	A/D 19x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP