PIC18F25J50-I/SP vs PIC18F26J50-I/SP

This detailed comparison of PIC18F25J50-I/SP and PIC18F26J50-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F25J50-I/SP

Roving Networks / Microchip Technology

Request For Quote

PIC18F26J50-I/SP

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 32KB FLASH 28SPDIP	IC MCU 8BIT 64KB FLASH 28SPDIP
In Stock	239	736
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 18J	PIC® XLP™ 18J
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	48MHz	48MHz
Connectivity	I²C, SPI, UART/USART, USB	I²C, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	16	16
Program Memory Size	32KB (16K x 16)	64KB (32K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	3.8K x 8	3.8K x 8
Voltage - Supply (Vcc/Vdd)	2.15V ~ 3.6V	2.15V ~ 3.6V
Data Converters	A/D 10x10b	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP