PIC18F26J50-I/ML vs PIC18LF26J50T-I/ML

This detailed comparison of PIC18F26J50-I/ML and PIC18LF26J50T-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F26J50-I/ML

PIC18F26J50-I/ML

Roving Networks / Microchip Technology

PIC18LF26J50T-I/ML

PIC18LF26J50T-I/ML

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Description IC MCU 8BIT 64KB FLASH 28QFN IC MCU 8BIT 64KB FLASH 28QFN
In Stock 897 170
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PIC® XLP™ 18J PIC® XLP™ 18J
Package Tube Tape & Reel (TR)
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 48MHz
Connectivity I²C, SPI, UART/USART, USB I²C, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 16 16
Program Memory Size 64KB (32K x 16) 64KB (32K x 16)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 3.8K x 8 3.8K x 8
Voltage - Supply (Vcc/Vdd) 2.15V ~ 3.6V 2V ~ 3.6V
Data Converters A/D 10x10b A/D 10x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-QFN (6x6) 28-QFN (6x6)
Part Number Manufacturer Description Request For Quote
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